Design and development of Heat Sinks for high speed microprocessor based on nano-fluid

In the present Era microprocessors are part of every high-performance electronic equipment. These high-speed microprocessors are also prone to produce high heat flux due to high heat flux generation. Although, this problem can be catered by using heat sinks for continual removal of heat but more app

Project Title

Design and development of Heat Sinks for high speed microprocessor based on nano-fluid

Project Area of Specialization

Mechanical Engineering

Project Summary

In the present Era microprocessors are part of every high-performance electronic equipment. These high-speed microprocessors are also prone to produce high heat flux due to high heat flux generation. Although, this problem can be catered by using heat sinks for continual removal of heat but more appropriate design for heat sink is required to increase its thermal and hydraulic performance so corresponding electronic equipment should remain in safe temperature range for its operation. This substantial increase in power coupled with the decrease in the size has resulted in a massive heat flux generation by the processor. For the processor to function proper and to prevent the thermal damage it is imperative to remove the heat generated. Conventional air-cooled heat sinks have almost maximized their potential to dissipate the heat generated and struggle to cope with the heat generated by the modern top of the line microprocessors and graphics processing units. As a result, these heat sinks are gradually being replaced by liquid cooled heat sinks.

The performance of Liquid cooled heatsinks are mainly depend on the following factors:

1. Geometry of Distributor and Collector Header of Heatsink.
2. Pressure drop in headers.
3. Pressure drop in heatsink channels.
4. Number of Heatsink channels.
5. Type of coolant used for heat transfer.
6. Temperature distribution on the base of heatsink.

as per mentioned factors we are only deal with the header geometry, Temperature distribution and coolant factors to optimize the heatsink design for batter performance.

To optimize the distributor and Collector header geometry in heatsink eliminating flow channel pressure terms and just equating distributer and collector pressure drop terms we can get equation for hydrolic diameter, hydrolic diameter depend on width of header geometry, By iterative method (using MATLAB) width of distributer and collector was obtained. Using MATLAB data we had design a new heatsing model on SolidWorks. To analyze and simulate the model we had used COMSOL and ANSYS. 

we had selected AL2O3- Nanoparticles to prepare nano-fluid which is more efficient and has more heat transfer capacity than water. To test these nano-fluid we had design a setup for our project to test the heatsink design as well as the effect of nano-fluid on the heatsink, the setup is named as Test bed for HeatSink Performance.

Project Objectives

The main outcomes/Objectives of the above project ar as follow:

1. Proposed a new design of equal pressure drop in heatsink.
2. To increase the heat transfer rate in new design of heatsink as compare to conventional design.
3. How header ( collector and distributer ) geometry effects the heatsink efficiency.
4. Maintain the equal pressure drop in proposed design.
5. Design an experimental setup for evaluation of Heat Sinks for there experimental evaluation.
6. Reduce the size and material cost for Heatsink preparation. 

 Maintaining the same dimensions and increase the capacity of Heat Sinks. enabling to increase the production if necessary.

Project Implementation Method

First of all we will be selecting commercial conventional heat sink and using it dimensions we will be optimizing the heat sink geometry for header design to get minimum pressure drop and while keeping minimum area for distributer and collector than a mathematical model will be designed to find out the pressure drop across the heat sink using MATLAB than a CAD model will be designed and then we will be doing simulations using ANSYS after that we will be selecting the nano fluid as a coolant at last we will be entering the experimental stage where we will check the experimental behavior of heat sink to compare it with the theoretical results. 

Following are the steps to proceed over project:

1. Heat Sink Selection
2. Mathematical design for header geometry
3. Creo-Modelling for header geometry
4. Analytical Modelling (ANSYS/COMSOL)
5. Nano-Fluid Selection
6. Experimental study and setup

Benefits of the Project

The project covers alot of applications in industries and in commercial sector, but some of its major benefits for what this project was choosen for work are:

1. This heatsink is design and fabricated for industries and commercially used super-computers and for Gaming PC. 
2. These liquid cooled heatsink are used to increase the life of your CPU/Processors.
3. This project is also cover the goal of sustainable development to meet the energy demand in 21th century.
4. Till now the the testing of heatsink is difficult, so we had design an apparatus to test the heatsinks to check the performance of heatsinks.
5. this apparatus will help to the researcher and analyzers to get validate there theoretical results with experimental results.
6. New design of heatsink reduce the maintenance Cost and material cost due to its high heat transfer rate and size.
7. it has cycle flow of water therefore it is environment friendly.
8. This project has got its application for its thermal confirt, Computer industry, Crypto mining industry and for Gaming industry.

Technical Details of Final Deliverable

This section specifies the information necessary for the design and fabrication of heatsinks and its experimental setup components such as coolant, reservoir, heatsink cover, etc...

1. Design Temperature.
2. Material for heatsink, cover, coolant reservoir, tubes and valves.
3. Size of tubes.
4. Fitting for tubes.
5. Coolant Reservoir design (capacity: 2L)
6. volume control valves.
7. Flow sensor ( range: 0.3-6 L/min)
8. Heatsink Models (conversational and new designed).
9. Radiator for liquid cooling.
10. Electric pump(12volts).
11. HeatSink cover design.

This section separately specifies the condition for liquid and heating element (heater) such as liquid inlet and outlet condition.......

1. Inlet and outlet Temperature of Liquid 
2. surface Temperature of microprocessor(heater).
3. composition of nano-fluid.
4. pressure of the tube.

Final Software based deliverables:

(example: simulation results.....)

1. MATLAB design (mathematical design).
2. SolidWorks modeling based on MATLAB Results.
3. Simulation results for different flow rates.
4. simulation results for water and nano-fluid coolant.
5. simulation results for base temperature distribution of both design.
6. simulation results for pressure drop in both design.
7. Arduino Coding for flow sensor and thermocouples.

Final Hardware deliverable:

1. Hard Model of heatsinks (conversational and new designed).
2. Reservoir for Coolant.
3. Radiator for liquid cooling.
4. Experimental setup for evaluation and experimentation of heatsinks for validation of there results.

Final Deliverable of the Project

Hardware System

Core Industry

Energy

Other Industries

Manufacturing , Others

Core Technology

Clean Tech

Other Technologies

Shared Economy, Clean Tech

Sustainable Development Goals

Good Health and Well-Being for People, Quality Education, Affordable and Clean Energy, Decent Work and Economic Growth, Industry, Innovation and Infrastructure, Responsible Consumption and Production, Partnerships to achieve the Goal

Required Resources

If you need this project, please contact me on contact@adikhanofficial.com