High performance microstrip patch array antenna supporting 5G Applications

The inherently narrow impedance bandwidth is the major weakness of a microstrip antenna. To tackle the narrow bandwidth problem of microstrip antennas, various techniques have been proposed and developed, e.g., parasitic patch either in stacked or coplanar geometries, U-slot patch, L-probe coupling,

2025-06-28 16:32:53 - Adil Khan

Project Title

High performance microstrip patch array antenna supporting 5G Applications

Project Area of Specialization Wearables and ImplantableProject Summary

The inherently narrow impedance bandwidth is the major weakness of a microstrip antenna. To tackle the narrow bandwidth problem of microstrip antennas, various techniques have been proposed and developed, e.g., parasitic patch either in stacked or coplanar geometries, U-slot patch, L-probe coupling, aperture coupling and increasing the thickness of the antenna.

The goal of this research is simultaneous achieving high data rate using MIMO technique on a patch array antenna designed for 28GHz center frequency in 5g Communication band.

Project Objectives

The core objectives of the planned effort are:

Project Implementation Method

•Most of our work will be carried out by simulations and getting better results so we mostly likely will use simulation software for that.

•We will use CST known as Computer Simulation Technology software due to the fact that it is user friendly and the results are calculated much thoroughly and we get better result.

•After the simulation is done and the desired results are achieved we will fabricate the antenna.

Benefits of the Project

The convergence of wireless communications and mobile computing is bringing together two areas of immense growth and innovation.

The microstrip antenna has many advantages such as low profile, small size, light weight, and ease to integrate with other carriers. 

Patch antennas have been used at 5G mmWave bands from 24 ghz up to 60+ GHz, usually as an a array for higher gain. While the design aid equation still holds, proper 3D Electromagnetic simulation is easily manufactured and fabricated at these frequencies.

Technical Details of Final Deliverable

1; Dielectric Substrate: FR4 , RT Duroid 6002, PTFE, RO4730, ceramic (Rogers RO 3200

2; Copper sheets and 

3; PCB FABRICATION MACHINE

Final Deliverable of the Project Hardware SystemType of Industry IT , Telecommunication Technologies Wearables and Implantables, OthersSustainable Development Goals Industry, Innovation and InfrastructureRequired Resources
Item Name Type No. of Units Per Unit Cost (in Rs) Total (in Rs)
Total in (Rs) 60000
Copper sheets Equipment101001000
Dielectric Substrates Equipment105005000
Connectors and Electronic Components Equipment20100020000
PCB Fabrication machine for antennas Equipment13000030000
Miscellaneous Miscellaneous 140004000

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