Design and optimisation of Splayed Heat Sink using COMSOL
In modern world technology is going faster and faster. Evolution if electronic micro chip and micro complex are important role in advancement. the trend in electronic equipment industries toward denser and more powerful products require a higher level of performance in cooling technology, many ideas
2025-06-28 16:31:54 - Adil Khan
Design and optimisation of Splayed Heat Sink using COMSOL
Project Area of Specialization Electrical/Electronic EngineeringProject SummaryIn modern world technology is going faster and faster. Evolution if electronic micro chip and micro complex are important role in advancement. the trend in electronic equipment industries toward denser and more powerful products require a higher level of performance in cooling technology, many ideas for cooling methods is proposed, one of which is heat sink. Various types of heat sinks have been developed widely used in industry due to high thermal performance. We have different types heat sink mostly are Plate-fin heat sinks, Pin-fin heat sinks and splayed heat sinks. These types of heat sinks have their own merits, they are commonly used a the cooling solutions for electronic equipment. Splayed heat sinks are relatively new derivates of the other standard pin fin heat sink. unlike standard pin fin heat sinks, which contain an array of vertically oriented pins, splayed pin fin features pins that are gradually bend outward. Curving the pins in this way increases the spacing between the pins and allows surrounding air streams to enter and exit the pin array more efficiently without sacrificing surface area. The impact of increased pin spacing on heat sink for which the thermal resistance of heat sink is minimal up to 30% as compared to other heat inks. The objective of our study is the comparison of thermal resistance and pressure drop of splayed heat sink in COMSOL multi-physics, compare their results to literature and then optimise the heat sink so that a best design can be chosen and can be implemented on hardware afterwards.
Project Objectives- To make the project more economical by using software for designing purposes .
- To design an efficient heat sink in comsol® by technique of optimization.
- To design a model of optimized size and more efficient.
- Experiments are performed on hardware and its results are analyzed and compared with software.
Instead of using experimental techniques to analyse the behaviour of different models of heat sink. COMSOL multi-physics is selected for this purpose because it provide better user GUI designing. It provide best environment for testing. The advantage to use the software for selecting the efficient heat sink is that it is cost free. We use COMSOL and select the efficient type of heat sink.
The most important is selection of flow type. In a tunnel laminar flow is selected because turbulent flow cause many irregularities in the tunnel setup. The velocity in laminar flow is constant but in turbulent flow velocity changes it’s magnitude along with it’s direction. The type of flow can be better defined in terms of reynold’s number. Reynold’s number is a dimensionless property which tells about the type of flow either laminar or turbulent.
Benefits of the Project- Splayed heat sinks contains an array of vertically oriented round pins made of copper or aluminum.
- It has Omni-directional configuration.
- Curving pins increases spacing between pins which allows more air streams to enter and exit.
- Reduces heat sink's thermal resistance by 30%.
- The temperature difference across a structure when net heat flows through it in a fixed time. Our concern is to have minimum thermal resistance.
R_th=1/h_0 ×(A_b+N.A_fin ) ?
- Pressure drop is total loss in pressure when fluid is passing through any structure like heat sink.
?P=f×(?×v^2)/2 Pa/m
Final Deliverable of the Project Software SystemCore Industry Energy Other IndustriesCore Technology OthersOther TechnologiesSustainable Development Goals Affordable and Clean EnergyRequired Resources| Item Name | Type | No. of Units | Per Unit Cost (in Rs) | Total (in Rs) |
|---|---|---|---|---|
| Total in (Rs) | 30000 | |||
| Software installation | Miscellaneous | 3 | 1000 | 3000 |
| Stationary (Pages, files, highliters, stepler etc) | Miscellaneous | 5 | 200 | 1000 |
| box (environment of heat sink) | Equipment | 2 | 3000 | 6000 |
| material design | Equipment | 1 | 15000 | 15000 |
| smart device (RAM) | Equipment | 2 | 2500 | 5000 |